Ultra-small LED electrode assembly and method for preparing same

ABSTRACT

Provided is a method of manufacturing a ultra-small light-emitting diode (LED) electrode assembly, the method including preparing a base substrate, forming an electrode line including a first electrode and a second electrode on the base substrate, positioning a guide member having a plurality of slit portions therein on the base substrate, and inserting ultra-small LED devices into the plurality of slit portions of the guide member.

TECHNICAL FIELD

The present invention relates to a ultra-small light-emitting diode(LED) electrode assembly and a manufacturing method thereof, and moreparticularly, to a ultra-small LED electrode assembly which can be usedto emit light and a manufacturing method thereof.

BACKGROUND ART

A light-emitting diode (LED) is a semiconductor device having astructure, in which an n type semiconductor crystal in which a largenumber of carriers are electrons and a p type semiconductor crystal inwhich a large number of carriers are holes are connected to each otherusing characteristics of a compound semiconductor, and converts anelectrical signal into light having a wavelength range of a desiredregion and emits the light.

Korean Laid-Open Patent Publication No. 2015-0006798 (publication date:Jan. 19, 2015) discloses a ultra-small LED electrode assembly and amanufacturing method thereof. The ultra-small LED electrode assembly maybe manufactured by arranging ultra-small LED devices on an electrodeline including a first electrode and a second electrode arranged to beinterdigitated with each other.

In the ultra-small LED electrode assembly, the first and secondelectrodes are formed in a bar shape and arranged in parallel to eachother in one direction. The ultra-small LED devices each have acylindrical shape. The ultra-small LED electrode assembly may bemanufactured by applying a solution containing the ultra-small LEDdevices onto the electrode line to place the ultra-small LED devices onthe electrode line.

In this case, light may be emitted when each of the ultra-small LEDdevices is connected to both the first and second electrodes but a largenumber of ultra-small LED devices among the plurality of ultra-small LEDdevices in the solution may not be connected to both the first andsecond electrodes. Accordingly, when the number of ultra-small LEDdevices which are not connected to both the first and second electrodesis large, light extraction efficiency may decrease.

DISCLOSURE Technical Problem

An embodiment of the present invention is directed to a ultra-smalllight-emitting diode (LED) electrode assembly, in which ultra-small LEDdevices may be connected to a first electrode and a second electrodewithout causing the occurrence of a defect such as an electrical shortcircuit, and a manufacturing method thereof.

Another embodiment of the present invention is directed to a ultra-smallLED electrode assembly, in which ultra-small LED devices may bedistributed in a predetermined region of an electrode line, and amanufacturing method thereof.

Technical Solution

One aspect of the present invention provides a method of manufacturing aultra-small light-emitting diode (LED) electrode assembly, the methodincluding preparing a base substrate, forming an electrode lineincluding a first electrode and a second electrode on the basesubstrate, forming a guide member including a plurality of slit portionson the base substrate, and inserting ultra-small LED devices into theplurality of slit portions of the guide member.

The forming of the guide member including the plurality of slit portionson the base substrate may include aligning the guide member such thatthe plurality of slit portions of the guide member are perpendicular tothe electrode line which is in the form of a line.

The method may further include removing the guide member formed on thebase substrate.

The inserting of the ultra-small LED devices into the plurality of slitportions of the guide member may include discharging a solutioncontaining the ultra-small LED devices to a region of the guide memberin which the plurality of slit portions are formed.

Another aspect of the present invention provides a ultra-small LEDelectrode assembly including a base substrate; an electrode lineincluding a first electrode and a second electrode arranged spaced apartfrom each other on the same plane on the base substrate; a guide memberformed on the base substrate and having formed therein a plurality ofslit portions positioned to correspond to the electrode line so as toaccommodate ultra-small LED devices; and the ultra-small LED deviceseach having one side connected to the first electrode and another sideconnected to the second electrode.

A width of each of the plurality of slit portions may be greater than orequal to an external diameter of the ultra-small LED device.

The guide member may be formed in a size corresponding to a size of thebase substrate.

The first electrode and the second electrode may be in the form of aline and be formed to be interdigitated with each other. The ultra-smallLED device may be positioned on the electrode line to be perpendicularto a lengthwise direction of the first electrode and the secondelectrode.

The guide member may be formed to cover a surface of the base substrateand a surface of the electrode line.

The guide member may be in the form of a plate and be formed such that abottom surface thereof is in contact with a top surface of the electrodeline.

Advantageous Effects

In a method of manufacturing a ultra-small light-emitting diode (LED)electrode assembly according to an embodiment of the present invention,ultra-small LED devices may be located perpendicular to a firstelectrode and a second electrode. Accordingly, the number of ultra-smallLED devices to be connected to the first and second electrodes among theultra-small LED devices increases and thus the number of photonsdischarged to the outside from the ultra-small LED electrode assemblyincreases, thereby remarkably improving the light extraction efficiencyof the ultra-small LED electrode assembly.

In addition, the number of ultra-small LED devices to be placed on anelectrode line may be easily adjusted by simply adjusting the number ofslit portions to be formed in a guide member.

DESCRIPTION OF DRAWINGS

FIG. 1 is a flowchart of a method of manufacturing a ultra-smalllight-emitting diode (LED) electrode assembly according to an embodimentof the present invention.

FIGS. 2 to 5 are diagrams sequentially illustrating the method ofmanufacturing a ultra-small LED electrode assembly.

FIG. 2 is a diagram illustrating a state in which a first electrode anda second electrode are formed on a base substrate.

FIG. 3 is a diagram illustrating a state in which a guide member isformed on the base substrate.

FIG. 4 is a diagram illustrating a process of discharging a solutioncontaining ultra-small LED devices in a state in which the guide memberis formed on the base substrate.

FIG. 5 is a diagram illustrating a ultra-small LED electrode assemblyaccording to an embodiment of the present invention.

FIG. 6 is a cross-sectional view taken along line VI-VI′ of theultra-small LED electrode assembly of FIG. 5.

FIG. 7 is a diagram illustrating a ultra-small LED electrode assemblyaccording to another embodiment of the present invention.

FIG. 8 is a diagram illustrating a process of placing a plate type guidemember on a base substrate.

MODES OF THE INVENTION

Hereinafter, exemplary embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings so thatthose of ordinary skill in the art can easily implement them. Thepresent invention may be embodied in many different forms and is notlimited to the embodiments set forth herein.

For clarity, a description of parts not related to describing thepresent invention is omitted here, and the same reference numerals areallocated to the same or similar components throughout the disclosure.

Components having the same structure in various embodiments will beallocated the same reference numeral and explained only in arepresentative embodiment, and components which are different from thoseof the representative example will be described in the otherembodiments.

As used herein, when an element is referred to as being “connected to”another element, the element can be directly connected to the otherelement or be indirectly connected to the other element having anintervening element therebetween. It will be understood that the terms“comprise” and/or “comprising,” when used herein, specify the presenceof stated elements but do not preclude the presence or addition of oneor more other elements unless mentioned otherwise.

When embodiments of the present invention are described herein, theterms “first electrode” and “second electrode” may be understood toinclude either electrode regions in which ultra-small LED devices may beactually mounted or not only the electrode regions but also electroderegions which may be further included according to a method of arrangingelectrodes on a base substrate. However, the ultra-small LED electrodeassembly according to the present invention may be understood as anelectrode region in which the ultra-small LED devices may be actuallymounted.

FIG. 1 is a flowchart of a method of manufacturing a ultra-smalllight-emitting diode (LED) electrode assembly according to an embodimentof the present invention.

Referring to FIG. 1, a method of manufacturing a ultra-small LEDelectrode assembly according to an embodiment of the present invention(S100) includes preparing a base substrate (S110), forming an electrodeline including a first electrode and a second electrode on the basesubstrate (S120), forming a guide member including a plurality of slitportions on the base substrate (S130), and inserting ultra-small LEDdevices into the slit portions of the guide member (S140).

The operations of the above-described method of manufacturing aultra-small LED electrode assembly according to the embodiment of thepresent invention will be described in detail with reference to theaccompanying drawings.

FIGS. 2 to 5 are diagrams sequentially illustrating the method ofmanufacturing a ultra-small LED electrode assembly. FIG. 2 is a diagramillustrating a state in which a first electrode and a second electrodeare formed on a base substrate.

Referring to FIG. 2, in the preparing of the base substrate (S110), abase substrate 110 is fixed on a support unit (not shown). Here, thesupport unit may be a support unit used to fix a specific object in ageneral semiconductor manufacturing process and thus a detaileddescription thereof is omitted herein.

After the preparing of the base substrate (S110) (see FIG. 1), theforming of the electrode line including the first electrode and thesecond electrode on the base substrate (S120) (see FIG. 1) is performed.

An example of a method of forming first electrodes 121 and secondelectrodes 122 on the base substrate 110 will be described below. Aphotoresist layer 101 may be formed by coating photoresist PR onto thebase substrate 110. The photoresist PR may be photoresist generally usedin the art. The photoresist PR may be coated onto the base substrate 110by spin coating, spray coating, or screen coating. Preferably, spincoating may be used but embodiments are not limited thereto.

A thickness of the photoresist PR coated onto the base substrate 110 maybe in a range of 0.1 μm to 10 μm. However, the thickness of the coatedphotoresist PR may be variable according to a manufacturer's design bytaking into account a thickness of electrodes to be deposited on thebase substrate 110 at a later time.

After the photoresist layer is formed on the base substrate 110 asdescribed above, a mask having formed therein a pattern corresponding toan electrode line 120 on which the first electrodes 121 and the secondelectrodes 122 are arranged spaced apart from each other on the sameplane to be interdigitated with each other may be placed on thephotoresist layer 101 and then an upper portion of the mask may beexposed to ultraviolet rays.

Thereafter, unexposed portions of the photoresist layer 101 may beremoved by immerging the photoresist layer 101 into a generalphotoresist solvent, and thereby the exposed portions of the photoresistlayer 101 at which the electrode line 120 is to be formed may beremoved.

Next, an electrode forming material may be deposited on the basesubstrate 110 from which the portions of the photoresist layer 101 areremoved in the form of a mask having formed therein the electrode line120. In the case of the first electrode 121, the electrode formingmaterial may include either at least one metal material selected fromthe group consisting of aluminum, titanium, indium, gold, and silver orat least one transparent material selected from the group consisting ofindium tin oxide (ITO), ZnO:Al, CNT-conductive polymer, and a metalnanowire complex.

Preferably, when the electrode forming material includes two or moretypes of materials, the first electrode 121 may have a structure inwhich the two or more types of materials are stacked. More preferably,the first electrode 121 may be an electrode formed by stacking two typesof materials, e.g., titanium and gold, but is not limited thereto.

In the case of the second electrode 122, the electrode forming materialmay include either at least one metal material selected from the groupconsisting of aluminum, titanium, indium, gold, and silver or at leastone transparent material selected from the group consisting of ITO,ZnO:Al, CNT-conductive polymer, and a metal nanowire complex.Preferably, when the electrode forming material includes two or moretypes of materials, the second electrode 122 may have a structure inwhich the two or more types of materials are stacked. More preferably,the second electrode 122 may be an electrode formed by stacking twotypes of materials, e.g., titanium and gold, but is not limited thereto.

Materials used to form the first electrode 121 and the second electrode122 may be the same or different. The electrode forming material may bedeposited by heat deposition, e-beam deposition, sputtering deposition,or screen printing, and preferably, heat deposition, but is not limitedthereto.

After the deposition of the electrode forming material, the electrodeline 120 deposited on the base substrate 110 may be manufactured byremoving the photoresist layer coated onto the base substrate 110 with aphotoresist remover selected from among acetone, N-methylpyrrolidone(1-Methyl-2-pyrrolidone (NMP)), and dimethyl sulfoxide (DMSO).

A unit electrode area of the electrode line 120 according to the presentinvention formed by the above-described method, i.e., an area of anarrangement region in which two electrodes are arranged to independentlydrive ultra-small LED devices 141, may be preferably in a range of 1 μm²to 100 cm², and more preferably, a range of 10 μm² to 100 mm², but isnot limited thereto.

In the electrode line 120, a distance between the first electrode 121and the second electrode 122 may be less than or equal to a length ofthe ultra-small LED device 141. Thus, the ultra-small LED device 141 maybe interposed in a lying state between the first electrode 121 and thesecond electrode 122 or may be connected while lying from the firstelectrode 121 to the second electrode 122.

In the forming of the electrode line including the first electrode andthe second electrode on the base substrate (S120) (see FIG. 1), a firstlead electrode 123 and a second lead electrode 124 may be formedtogether. The first lead electrode 123 and the second lead electrode 124will be described below.

FIG. 3 is a diagram illustrating a state in which a guide member isformed on the base substrate.

Referring to FIG. 3, in the forming of the guide member including theplurality of slit portions on the base substrate (S130) (see FIG. 1),the expression “the forming of the guide member” may be understood toinclude not only directly forming a guide member 130 on a surface of thebase substrate 110 but also positioning the guide member 130 to bespaced apart from the base substrate 110.

For example, the guide member 130 may be formed to cover the surface ofthe base substrate 110 and a surface of the electrode line 120.Alternatively, although not shown, the guide member 130 may be formedin, for example, a plate shape such that a bottom surface thereof is incontact with a top surface of the electrode line 120. That is, the guidemember 130 may be spaced a thickness of the electrode line 120 from thebase substrate 110.

When the guide member 130 has the plate shape as described above, in theforming of the guide member including the plurality of slit portions onthe base substrate (S130) (see FIG. 1), a process of aligning the guidemember may be performed such that a plurality of slit portions 131 ofthe guide member 130 are perpendicular to the electrode line 120 havinga line shape.

More specifically, when the first electrode 121 and the second electrode122 of the electrode line 120 are formed in parallel in a direction fromleft to right, the plurality of slit portions 131 may be positioned suchthat a lengthwise direction thereof is the same as a direction fromfront to rear. That is, the plurality of slit portions 131 may bepositioned to form 90° with the first electrode 121 and the secondelectrode 122.

In a method of aligning the guide member 130, for example, an align unit(not shown) may be used. The guide member 130 may be aligned on the basesubstrate 110 using an align unit movable along three axes. The guidemember 130 may be coupled to a side of the align unit.

The align unit may be a device capable of moving a target in multipledirections. To this end, the align unit may be any type of devicecapable of moving a specific member along three or more axes and thus isnot limited to a specific structure.

FIG. 4 is a diagram illustrating a process of discharging a solutioncontaining ultra-small LED devices in a state in which the guide memberis formed on the base substrate.

As illustrated in FIG. 4, in the inserting of the ultra-small LEDdevices into the slit portions of the guide member (S140) (see FIG. 1),for example, a solution 140 containing the ultra-small LED devices 141may be discharged onto a region of the guide member 130 in which theplurality of slit portions 131 are formed.

Here, the solution 140 containing the ultra-small LED devices 141 may beprepared by, for example, mixing the plurality of ultra-small LEDdevices 141 with a solvent. The solution 140 may be in the form of inkor paste. The solvent may preferably include at least one selected fromthe group consisting of acetone, water, alcohol, and toluene, and morepreferably, acetone. However, the type of the solvent is not limitedthereto, and any solvent which is evaporable without physically orchemically influencing the ultra-small LED devices 141 may be usedwithout limitation.

In the solution 140, a content of the ultra-small LED devices 141 may bein a range of 0.001 to 100 parts by weight with respect to 100 parts byweight of the solvent. When the content of the ultra-small LED devices141 is less than 0.001 parts by weight, the number of ultra-small LEDdevices 141 connected to the electrodes is small and thus theultra-small LED electrode assembly 100 may not be operated normally. Tosolve this problem, the solution 140 may need to be discharged onto theguide member 130 several times. When the content of the ultra-small LEDdevices 141 is greater than 100 parts by weight with respect to 100parts by weight of the solvent, alignment of each of the ultra-small LEDdevices 141 may be interfered with each other.

The ultra-small LED device 141 will be described below. The type of theultra-small LED device 141 available in the present invention is notlimited, provided that it can be generally used in an illuminationdevice or a display device. The length of the ultra-small LED device 141may be preferably in a range of 100 nm to 10 μm, and more preferably, arange of 500 nm to 5 μm.

In addition, an external diameter of the ultra-small LED device 141 maybe in a range of 1 nm to 10 μm, and more preferably, a range of 50 nm to4 μm.

Here, a highly efficient LED device may be difficult to manufacture whenthe length of the ultra-small LED device 141 is less than 100 nm, andthe luminous efficiency of an LED device may be deteriorated when thelength of the ultra-small LED device 141 is greater than 10 μm. Theultra-small LED device 141 may have various shapes, e.g., a cylindricalshape, a cuboid shape, etc., and preferably, the cylindrical shape, butis not limited thereto.

The ultra-small LED device 141 may be a nanorod, a nanocable, a nanocotton ball, or a nano-dumbbell.

FIG. 7 is a diagram illustrating a ultra-small LED electrode assemblyaccording to another embodiment of the present invention.

Referring to FIG. 7, the method of manufacturing a ultra-small LEDelectrode assembly (S100) (see FIG. 1) according to an embodiment of thepresent invention may further include removing the guide member formedon the base substrate (S150) (see FIG. 1).

The removing of the guide member formed on the base substrate (S150)(see FIG. 1) may be performed after the insertion of the ultra-small LEDdevices 141 into the slit portions 131 of the guide member 130. Theguide member 130 may be removed by, for example, forming the guidemember 130 of a material reacting to (or etched by) only a specificetching solution and removing the guide member 130 with the etchingsolution, but embodiments are not limited thereto and any method may beused provided that only the guide member 130 can be removed from thebase substrate 110.

For example, the guide member may be removed by dry etching.

Referring back to FIGS. 5 and 6, in the ultra-small LED electrodeassembly 100 manufactured by the above-described method of manufacturinga ultra-small LED electrode assembly (S100) (see FIG. 1) according tothe embodiment of the present invention, the ultra-small LED devices 141may be connected to the first electrode 121 and the second electrode 122to be perpendicular to the first electrode 121 and the second electrode122.

Accordingly, the number of ultra-small LED devices 141 to be connectedto the first electrode 121 and second electrode 122 among theultra-small LED devices 141 may increase and thus the number of photonsdischarged to the outside from the ultra-small LED electrode assembly100 increases, thereby remarkably improving the light extractionefficiency of the ultra-small LED electrode assembly 100.

In addition, the number of ultra-small LED devices 141 to be placed onthe electrode line 120 may be easily adjusted by simply adjusting thenumber of slit portions 131 to be formed in the guide member 130.

The ultra-small LED electrode assembly 100 which may be manufactured bythe method of manufacturing a ultra-small LED electrode assembly (S100)(see FIG. 1) according to the embodiment of the present invention willbe described in detail below.

The ultra-small LED electrode assembly 100 according to the embodimentof the present invention may include the base substrate 110, theelectrode line 120, the guide member 130, and the ultra-small LEDdevices 141.

The base substrate 110 may be, for example, one selected from among aglass substrate, a quartz substrate, a sapphire substrate, a plasticsubstrate, and a bendable and flexible polymer film. However, the typeof the base substrate 110 is not limited thereto and various othermembers may be used provided that electrodes can be formed thereon. Thebase substrate 110 may be formed of a transparent material.

An area of the base substrate 110 is not limited, and may be changedaccording to a manufacturer's design by taking into account an area ofthe first electrode 121 and an area of the second electrode 122 to beformed on the base substrate 110, and a size and number of ultra-smallLED devices 141 connected to the first electrode 121 and the secondelectrode 122. For example, a thickness of the base substrate 110 may bein a range of 100 μm to 1 mm but is not limited thereto.

The electrode line 120 include the first electrode 121 and the secondelectrode 122. The second electrode 122 may be formed to be spaced apartfrom the first electrode 121. The second electrode 122 may be formed onthe same plane as the first electrode 121. For example, the firstelectrode 121 and the second electrode 122 may be formed on a topsurface of the base substrate 110.

The first lead electrode 123 and the second lead electrode 124 may beformed on the base substrate 110. The first lead electrode 123 and thesecond lead electrode 124 may be formed on the same plane as the firstelectrode 121 and the second electrode 122. The first electrode 121 iselectrically connected to the first lead electrode 123, and the secondelectrode 122 is electrically connected to the second lead electrode124.

In the forming of the electrode line including the first electrode andthe second electrode on the base substrate (S120) (see FIG. 1), thefirst lead electrode 123 and the second lead electrode 124 may be formedtogether with the first electrode 121 and the second electrode 122 butembodiments are not limited thereto.

The guide member 130 is located on the base substrate 110. A size of theguide member 130 may correspond, for example, to that of the basesubstrate 110. The plurality of slit portions 131 positioned tocorrespond to the electrode line 120 may be formed in the guide member130.

The guide member 130 may be formed on the base substrate 110. Here, theforming of the guide member on the base substrate 110 may be understoodto mean that the guide member 130 may be directly formed on a surface ofthe base substrate or be formed spaced apart from an upper part of thebase substrate 110.

For example, the guide member 130 may be formed to cover the surface ofthe base substrate 110 and the surface of the electrode line 120.Alternatively, the guide member 130 may be formed on the top surface ofthe electrode line 120. More specifically, as illustrated in FIG. 8, theguide member 130 may be separately manufactured and then be placed onthe base substrate 110 using an align unit (not shown).

Thus, the guide member 130 may be formed such that a bottom surfacethereof is in contact with the top surface of the electrode line 120 andthe guide member 130 is spaced the thickness of the electrode line 120from the base substrate 110.

As described above, the plurality of slit portions 131 are formed in theguide member 130. The plurality of slit portions 131 are positioned tocorrespond to the electrode line 120. The ultra-small LED devices 141are accommodated in the plurality of slit portions 131. The plurality ofslit portions 131 may be formed at certain intervals.

A width of the slit portion 131 may be greater than or equal to theexternal diameter of the ultra-small LED device 141. However, when thewidth of the slit portion 131 is greater than the external diameter ofthe ultra-small LED device 141, the ultra-small LED device 141 may bemore smoothly accommodated in the slit portion 131. When the width ofthe slit portion 131 is greater than the external diameter of theultra-small LED device 141, the width of the slit portion 131 should beless than the length of the ultra-small LED device 141.

The ultra-small LED device 141 emits light. A plurality of ultra-smallLED devices 141 may be provided. One side of the ultra-small LED device141 is connected to the first electrode 121 and another side thereof isconnected to the second electrode 122,

In the ultra-small LED electrode assembly 100 according to theembodiment of the present invention, the ultra-small LED device 141 maybe located on the electrode line 120 to be perpendicular to a lengthwisedirection of the first electrode 121 and the second electrode 122 due tothe guide member 130. In this case, the first electrode 121 and thesecond electrode 122 may be provided in the form of a line to beinterdigitated with each other. The ultra-small LED device 141 may havea certain length and be positioned to form 90° with the first electrode121 and the second electrode 122.

While various embodiments of the present invention have been describedabove, the drawings referred to herein and the detailed description ofthe present invention are merely intended to provide examples of thepresent invention, and are for the purpose of describing the presentinvention only and are not intended to limit meanings or the scope ofthe present invention defined in the claims. Thus, it will be apparentto those of ordinary skill in the art that various modifications may bemade in the embodiments and equivalent embodiments may be derived fromthe embodiments. Accordingly, the scope of the present invention to beprotected should be determined by the technical scope defined in theappended claims.

The invention claimed is:
 1. A light-emitting diode (LED) electrodeassembly comprising: a base substrate; a plurality of first electrodesand second electrodes on the base substrate which extend to a firstdirection and are spaced apart from each other in a second direction; aguide member disposed on the base substrate and having formed therein aplurality of slit portions extending to the second direction andexposing at least a portion of the plurality of first electrodes andsecond electrodes and the base substrate; and a plurality of LED devicesdisposed in the slit portions of the guide member and, connected to theplurality of first electrodes and second electrodes, wherein each LEDdevice has a shape of extending to the second direction, and one end ofeach of the LED devices is disposed on one of the plurality of firstelectrodes and another end of each of the LED devices is disposed on oneof the plurality of second electrodes, and a first length of theplurality of first electrodes and second electrodes which is measured inthe first direction is longer than a first width of the plurality offirst electrodes and second electrodes which is measured in the seconddirection, a second length of the slit portions which is measured in thesecond direction is longer than a second width of the slit portionswhich is measured in the first direction, and a long axis direction ofthe plurality of first electrodes and second electrodes is perpendicularto a long axis direction of the slit portions, wherein each of the slitportions exposes the plurality of first electrodes and the plurality ofsecond electrodes.
 2. The LED electrode assembly of claim 1, wherein adistance between the plurality of first electrodes and the plurality ofsecond electrodes is less than or equal to a length of each of the LEDdevices, and a width of each of the plurality of slit portions isgreater than or equal to an external diameter of each of the LED devicessuch that a LED device from among the plurality of LED devices isinterposed in a lying state between a first electrode from among theplurality of first electrodes and a second electrode from among theplurality of second electrodes or is connected to the first electrodefrom among the plurality of first electrodes and the second electrodefrom among the plurality of second electrodes while lying from the firstelectrode to the second electrode of the plurality of first electrodesand second electrodes.
 3. The LED electrode assembly of claim 1, whereinthe guide member is formed in a size corresponding to a size of the basesubstrate.
 4. The LED electrode assembly of claim 1, wherein the guidemember is formed to cover a surface of the base substrate and a surfaceof at least one of the first and second electrodes.
 5. The LED electrodeassembly of claim 1, wherein the guide member is positioned to be spacedapart from the base substrate.
 6. The LED electrode assembly of claim 5,wherein, when the guide member is positioned to be spaced apart from thebase substrate during the forming of the guide member, the guide memberis aligned on the base substrate using an align unit movable along threeaxes.
 7. The LED electrode assembly of claim 1, wherein each of the slitportions has a constant width along an entire length of the slit portionin a plane parallel to the base substrate.